TP high-frequency PCB with OSP (Organic Solderability Preservative) coating without fiberglass reinforcement

Product Details:

Place of Origin:	China
Brand Name:	Bicheng Enterprise
Certification:	UL
Model Number:	BIC-253-V2.53

Payment & Shipping Terms:

Minimum Order Quantity:	1
Price:	USD 2.99-9.99 PER PIECE
Packaging Details:	Vacuum
Delivery Time:	10 working days
Payment Terms:	T/T, Western Union
Supply Ability:	45000 pieces per month

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Detailed Product Description

Number Of Layers:	2	Board Material:	Polyimide (PI) 25 Um
Surface Cu Thickness:	1.0	Board Thickness:	0.15mm +/-10%
Surface Finish:	Immersion Gold	Solder Mask Color:	Yellow
Colour Of Component Legend:	White	Test:	100% Electrical Test Prior Shipment

TP High Frequency PCB

Microwave composite dielectric copper-clad laminate - TP

Introduction

TP material is a unique high-frequency thermoplastic material in the industry. The dielectric layer of TP-type laminates consists of ceramics and polyphenylene Oxide resin (PPO), without fiberglass reinforcement. The dielectric constant can be precisely adjusted by adjusting the ratio between ceramics and PPO resin. The production process is special, and it has excellent dielectric performance and high reliability. TP refers to the smooth surface material without copper cladding, TP-1 refers to the material with copper cladding on one side, and TP-2 refers to the material with copper cladding on both sides.

Features

1. The dielectric constant can be arbitrarily selected within the range of 3 to 25 according to circuit requirements, and it is stable. Common dielectric constants include 3.0, 4.4, 6.0, 6.15, 9.2, 9.6, 10.2, 11, 16, and 20. The dielectric loss is low, and the loss increases as the frequency increases, but the change is not significant within 10 GHz.

Long-term operating temperature ranges from -100°C to +150°C. It has excellent low-temperature resistance. When the temperature exceeds 180°C, the material may deform, the copper foil may peel off, and there may be significant changes in electrical performance.
The thinnest thickness is 0.5mm, and it is available in various thicknesses and can be customized.
It is resistant to radiation and has low outgassing.
Ideal material for Beidou, missile-borne, fuze, and miniaturized antennas.
The adhesion between copper foil and dielectric is more reliable than ceramic substrates with vacuum coating. The material is easy to machine and can be processed through drilling, turning, grinding, shearing, etching, and other methods, which ceramic substrates cannot achieve.
Convenient for PCB processing, it can be processed using methods suitable for thermoplastic materials, resulting in high yield and reduced processing cost compared to ceramic substrates. Due to the characteristics of the material, it is generally not recommended for multilayer PCB processing. If multilayer PCB processing is required, low-temperature bonding sheets should be selected, and feasibility should be fully considered.

Data Sheet

Product Technical Parameter

Product Models & Data Sheet

Product Features

Test Conditions

Unit

TP TP-1 TP-2

Dielectric Constant

When the dielectric constant is ≤11, the test condition is 10GHz.

When the dielectric constant is >11, the test condition is 5GHz.

3.0±0.06

4.4±0.09

6.0±0.12

6.15±0.12

9.2±0.18

9.6±0.19

10.2±0.2

11.0±0.022

16.0±0.4

20.0±0.8

22.0±0.88

25.0±1.0

The dielectric constant can be customized within the range of 3.0 to 25.

Dielectric Constant Tolerance

Dielectric Constant 3.0～11.0

±2%

Dielectric Constant 11.1～16.0

±2.5%

Dielectric Constant 16.1～25.0

±4%

Loss Tangent

Loss Tangent 3.0～9.5

10GHz

0.0010

Loss Tangent 9.6～11.0

10GHz

0.0012

Loss Tangent 11.1～16.0

5GHz

0.0015

Loss Tangent 16.1～25.0

5GHz

0.0020～0.0025

Dielectric Constant Temperature Coefficient

Dielectric Constant 3.0～9.5

-55 º~150ºC

PPM/℃

-50

Dielectric Constant 9.6～16.0

-55 º~150ºC

PPM/℃

-40

Dielectric Constant 16.1～25.0

-55 º~150ºC

PPM/℃

-55

Peel Strength

1 OZ Normal State

N/mm

>0.6

1 OZ After AC Humidity Test

N/mm

>0.4

Volume Resistivity

Normal State at 500V

MΩ.cm

>1×109

Surface Resistivity

Normal State at 500V

MΩ

>1×107

Coefficient of Thermal Expansion
(XY Z)

Dielectric Constant 3.00～4.40

-55 º~150ºC

PPM/℃

60,60,70

Dielectric Constant 4.60～6.15

-55 º~150ºC

PPM/℃

50,50,60

Dielectric Constant 6.16～11.0

-55 º~150ºC

PPM/℃

40,40,55

Dielectric Constant 11.1～16.0

-55 º~150ºC

PPM/℃

40,40,50

Dielectric Constant 16.1～25.0

-55 º~150ºC

PPM/℃

35,35,40

Water Absorption

20±2℃, 24 hours

≤0.01

Long-Term Operating Temperature

High-Low Temperature Chamber

℃

-100º~150ºC

Material Composition

Polyphenylene ether, ceramic, paired with ED copper foil.

The density and thermal conductivity data for materials with different dielectric constants are as follows:

Product Features

Unit

Dielectric Constanct

3.0

4.4

6.0

6.15

9.6

10.2

11.0

16.0

20.0

22.0

25.0

Density

g/cm3

1.69

1.89

2.1

2.12

2.26

2.33

2.40

2.76

2.73

2.77

2.94

Thermal Conductivity

W/(M.K)

0.40

0.44

0.55

0.65

0.67

0.70

0.80

0.85

0.90

1.0

Our PCB Capability (TP Series)

PCB Capability (TP Series)
PCB Material:	Polyphenylene ether, ceramic
Designation (TP Series)	Designation	DK	DF
	TP300	3.0±0.06	0.0010
	TP440	4.4±0.09	0.0010
	TP600	6.0±0.12	0.0010
	TP615	6.15±0.12	0.0010
	TP920	9.2±0.18	0.0010
	TP960	9.6±0.2	0.0011
	TP1020	10.2±0.2	0.0011
	TP1100	11.0±0.22	0.0011
	TP1600	16.0±0.32	0.0015
	TP2000	20.0±0.4	0.0020
	TP2200	22.0±0.44	0.0022
	TP2500	25.0±0.5	0.0025
Layer count:	Single Sided, Double Sided PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness (Dielectric thickness or overall thickness)	0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 7.0mm, 8.0mm, 10.0mm, 12.0mm
PCB size:	≤150mm X 220mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

A TP PCB and Applications

On the screen, you can see a 1.5mm TP high-frequency PCB with OSP (Organic Solderability Preservative) coating. TP high-frequency PCBs are also utilized in applications such as Beidou, missile-borne systems, fuzes, and miniaturized antennas.

Final Attention

The material is not suitable for 260°C thermal shock testing and cannot be wave soldered. Hand soldering with a constant temperature soldering iron is recommended. Reflow soldering is generally not recommended. If reflow soldering is carried out, the highest set temperature should not exceed 200°C, and feasibility and stability should be fully considered.

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