TC350 PCB Material 0.6mm thick with Immersion Tin double layer 1oz copper

Engineers and designers, get ready to be wowed! We're rolling out our newest TC350 circuit board material. This material provides best-in-class thermal conductivity and dielectric stability for demanding high-frequency applications.

The TC350 uses a woven fiberglass reinforced, ceramic filled PTFE-based composite core material. Key specifications include:

• Dielectric Constant of 3.5 at frequencies up to 10 GHz
• Extremely low Dissipation Factor of just 0.002 at 10 GHz
• Industryleading Temperature Coefficient of -9 ppm/°C, ensuring minimal dielectric drift even in thermally stressed conditions

In addition to its electrical properties, the TC350 excels at heat dissipation. Its thermal conductivity of 1.0 W/mK allows efficient transfer of heat away from critical components. This thermal management capability is important for applications like power amplifiers that generate significant waste heat. The TC350 is also more robust and easier to drill than traditional circuit board materials. This improves manufacturability and reliability.

Stackup: 2-layer rigid PCB

• 35μm (1oz) copper is used for layer 1
• A 20mil (0.508mm) TC350 core is utilized
• 35μm (1oz) copper is used for layer 2

We are now offering basic 2-layer test boards made from this material. Key specs of the demonstration boards include:

• Dimensions of 98mm x 81mm
• Minimum traces/spacing of 6/7mil
• Core thickness of 0.508mm
• Total board thickness of 0.6mm
• 100% electrical testing

Features:

• “Best in Class” thermal conductivity (1.0 W/mK) and dielectric constant stability across wide temperatures (-9 ppm/°C) are delivered
• Very low loss tangent is provided for higher amplifier or antenna efficiency
• The PCB is priced affordably for commercial applications
• The PCB is made easier to drill than traditional commercial based laminates utilizing thick and dense style woven glass
• High peel strength for reliable copper adhesion in thermally stressed applications is offered

Benefits:

• Improved heat dissipation and management are enabled
• Enhanced processing and reliability are achieved
• Lowered processing costs are attained through large panel sizes for multiple circuit layouts

Typical Applications:

• Be used for power amplifiers, filters and couplers
• Tower mounted amplifiers (TMA) and tower mounted boosters (TMB) are supported
• Thermally cycled antennas sensitive to dielectric drift are accommodated
• Microwave combiners and power dividers are compatible

This board means business with a robust 2-layer rigid construction, immersion tin finish, and IPC Class 2 quality manufacturing. Rest assured your components will be safe and secure during routing and operation.

Ready to step up your PCB game? Our superstar Sales Engineer Sally is eager to answer your questions and get you set up with our advanced board technology. Give her a shout at sales30@bichengpcb.com for a free consult.

Join the future of circuitry and unlock the true potential of your designs with our new and improved PCB. We can't wait to see what you create!